Printed circuit board material, method and the shape of the holes can be used for blanking die processing, simple processing for PCB or the requirements are not very high PCB can be used for blanking method. PCB appearance and suitable for low level and high volume requirements are not very high is not high PCB production, low cost.
Punching:
Production volume, type and number of holes and the shape of the epoxy glass cloth substrate complex single-sided paper substrate and double-sided nonmetallic hole, usually a few pay or pay for die punching.
Shape processing:
Printed circuit board production of large quantities of single and double panel plate shape, usually used punch. According to the size of the printed board, can be divided into blanking die and blanking die.
Composite processing:
The hole hole and the printed circuit board, between the hole and the shape of the high accuracy, at the same time in order to shorten the manufacturing cycle, improve productivity, the use of compound die while processing a single panel and the shape of the holes.
Printing plate with the mould, the key is to mould design, processing and technical expertise is required. In addition, the installation and debugging of the die is also very important, at present most PCB production factory mold by offsite factory processing.
Mold installation note:
1 according to the blanking force calculation of mold design, mold size and height selection of punch (including type, tonnage).
2 start the machine, check including clutch, brake, the slider is normal, the operating mechanism is reliable, not even the phenomenon of punching.
The die pad iron 3, are generally 2, must be in the grinder and grinding, ensure the mold is installed in parallel and vertical. Iron pad placed a leap does not affect the blanking and as close as possible to the mold center.
4 to prepare several plate and T shaped head plate screws, to die and corresponding use. The front plate cannot touch the lower die straight wall. Between the contact surface of the pad cloth, screws must be tightened.
5 mold installation should pay great attention to the lower die on the nut and the screw die (don't touch the upper die down, closed).
6 adjust the die as possible by hand, and don't maneuver.
The 7 is to improve the performance of blanking of the substrate, the substrate to be treated with thermal paper. The temperature at 70 to 90 DEG C for good.
Die blanking PCB and its shape, has the following several quality defects:
Qiqiao around the holes or convex copper foil Alice or hierarchical; pore and pore crack; hole position partial hole or the vertical; burr; rough sections; punching printed board into the bottom of the pot shape warping; jump waste; waste blocking.
The examination and analysis steps are as follows:
Check the punching force, rigidity is enough; mold design is reasonable, whether enough rigidity; convex, concave die and the guide pillar, guide sleeve processing accuracy is reached, the installation is concentric, vertical. With the gap is uniform. Convex, concave clearance is too small or too much will produce quality defects, is the mold design, processing, debugging, the use of the most important issues. The convex and concave edge chamfer fillet is not allowed. The punch is not allowed to have a taper, especially when the punch is not allowed to be the positive cone and the inverted cone. At any time to pay attention to the production of convex, concave die cutting edge is worn. Discharge port is reasonable, small resistance. A pushing plate, a knockout bar is reasonable enough. Are washed to the thickness of the plate and the substrate binding force, with the volume of plastic, copper foil and the binding force and treated with heat and humidity and time also flush cutting quality defects analysis to consider factors.