Lead free electronic manufacturing owners melody (Figure)
April 12 - 15 days, the 15th session of the China international electronic production equipment and microelectronics industry exhibition NEPCON2005 in Shanghai, held as scheduled, from 21 countries and regions of 700 exhibitors, the exhibition become the most influential event in China's electronic manufacturing industry.
From the point of view of the exhibition and conference, lead-free, SMT placement machine, welding has become the three major hot spots of this exhibition. Among them, lead-free throughout throughout the show always, upgrade from lead-free based solder to electronic equipment, adumbrative lead-free wave approaching, become the main melody in the current period of electronic manufacturing industry.
Soldering and lead free to become the biggest bright spot
In 2006, Europe will enforce the about in electrical and electronic equipment in the prohibition of the use of certain Hazardous Substances Regulations. Therefore, this year will be a crucial year, the exhibition site response can be clearly seen. Welding area and lead free technology to become the biggest highlight of this exhibition.
Research on lead-free process as early as a few years ago, has been launched in the process, so the product will not cause too much impact, lead-free solder basically also can be supported by suppliers. For manufacturers, biggest concerns is the cost, in addition to the cost of the solder itself, due to the welding temperature components, connectors, etc. need to be able to afford to use different materials, which will increase the cost.
During the Nepcon, Nitto Technology (Holdings) Co., Ltd. show them for lead-free soldering N2 series reflow furnace and their newly agent Germany Rheem company C2 reflow furnace equipment. The company's marketing director Liang of the right, said the waste electrical and electronic equipment, and hazardous materials to disable the instructions within the global scope to SMT industry healthy and stable development provides explicit criteria, make electronic equipment manufacturers in development strategy have higher requirements. At the same time, the ban to China's electronic equipment manufacturers in the export of a certain pressure, the requirements of domestic electronic equipment manufacturers have enough flexibility, according to the national conditions to develop feasible development strategies.
Electronics assembly materials company, Kester, thousands of live metal (Shanghai) Co., Ltd., indium Technology (Suzhou) Co., Ltd., the United States OK company and many other companies show their lead-free materials, including solder paste, flux, solder wire, preform, solder ball and sealant etc..
In addition, lead-free requirements in addition to reflow soldering, the patch device also have to make the appropriate changes. According to Wang Jiafa, general manager of Universal Instruments Corporation in China, due to the temperature and stress of the solder joints, the different, so the placement machine in the graphics identification, placement accuracy of the higher requirements. In response to this demand, universal instruments of new launch of the placement machine in performance improved, placement accuracy increased 1 times, from the previous 50 microns up to plus or minus 25 micron, also on the image recognition technology also from analog processing to digital processing, which can ensure to have a better effect in lead free process.
At present, whether it is consumer home appliances or high-end notebook computers and communications equipment manufacturers are actively preparing for the arrival of lead-free era. Some manufacturers have begun to adjust the production supply chain, such as a number of small batch manufacturing, including the PCB circuit board design, raw materials and parts supply, production process equipment testing, etc..
Placement machines began to focus on flexibility
In all previous NEPCON exhibition, the placement machine is almost one of the leading role, this exhibition is no exception.
Issued from the equipment supplier information show that Mounter rate or price is no longer the only competitive advantage, the overall manufacturing capability and cost efficient has quickly become manufacturers focus, including production line flexibility, efficiency, resources and equipment utilization, assembly rate of good product and equipment upgrades and other factors, have become the key to maintain long-term sustainable development and advantages of the company.
Universal Instruments Wang added that the flexibility of the platform for daily needs assembly is vital to the customers of various types of circuit boards, mass production assembly business do not have styles and different circuit board assembly requirements and trouble, universal instruments can provide optimal solutions, we are able to for different production needs to configure the corresponding assembly lines, flexible and comfortable to deal with all sorts of chip mount or precision placement requirements, does not affect the productivity and easy to balance the production line.
Siemens logistics and assembly systems Ltd. the focus launched equipped with software to optimize the management system, the company's director of marketing, SvenBuchholz said the system focus on enhancing the efficiency of SMT production line, the modularization design concept for flexible user procurement and smooth upgrade with great convenience.
Electronic manufacturing industry chain is becoming more and more perfect
In addition to SMT placement machine, wave soldering machines and other large-scale manufacturing equipment, Nepcon exhibition this year also launched a three plate in measuring and testing, electronic manufacturing services and components of the production, to improve the electronic manufacturing industry chain concept.
Hualai Technology (Valor) is a Israel Corp that provides computer aided engineering software product line PCB. This paper focuses on the Tril-ogy5000 software package, Enterprise3000 and TrecXpert solutions.