Anti oxidation solder
Antioxidation solder is a new type of solder, in the conventional Sn Pb solder join trace of antioxidants melting and, it has a unique antioxidant, strong wettability and good physical, mechanical and corrosion resistance, is the ideal solder in the electronic industrial production lines, widely used in hot dip soldering and wave soldering.
Antioxidation solder has the following characteristics: the antioxidant effect is remarkable, at 260 DEG C + 10 static oxidation 24 hours, protective glasses and discoloration. The amount of slag produced by the position and dynamic mixing is only 1/6, and the oxidation loss of the solder is less. The welding resistance and excellent wettability of solder joints, rounded and full, bright, welding point over rate at the end of the qualified rate is high. Physic and mechanical properties to meet the national standard GB3131-88.
Lead free solder
Protect the natural environment, reduce industrial pollution, has been more and more people's attention. SMT (surface mount technology) production as part of the electronic production, but also inevitably there is a problem of environmental pollution. To find a solution to the SMT production pollution problems and ways to make SMT production to the direction of the development of green, which is one of the key issues of lead-free solder. Before the SMT production process is generally used Pb - Sn solder, which lead content of about 40%. As everyone knows the lead is a toxic metal will have bad effect on the human body and the surrounding environment. In order to eliminate lead pollution, the lead-free solder is imperative.
The research target of lead-free solder, lead-free solder should have characteristics similar with Sn - Pb system solder. The specific objectives are as follows:
Low toxicity, small to environmental impact.
The melting point should be the same Sn - Pb system solder melting point (183 C) close, should not exceed 200 DEG C.
Low cost, good conductivity.
The mechanical strength and thermal fatigue resistance should be roughly the same with Sn - Pb system solder.
Better storage stability of solder.
To install the equipment and the process conditions.
To ensure that the mechanical reliability of wettability and good after installation.
After welding the welding point and easy maintenance should have good reliability of electricity.
The main component of research status of lead-free solder - lead-free solder tin, the melting point is 232 DEG C, and other metals such as silver, bismuth, zinc alloy system etc..
Silver solder
Silver containing silver solder is used in silver wire, silver electrode device welding, to prevent the spread of silver, to prevent electric corrosion, with long-term use of good performance and invasive, solder joint quality is better than the equal content of tin lead solder. According to different user needs, the production of different specifications of the bar (strip) and wire products, bar (strip) like products can be used for soldering, wave soldering.
High temperature solder
The general characteristics of high melting point solder, welding is applied to the special requirements of the machinery manufacturing, aviation, electronic and textile work at higher temperatures in parts and components.
Low temperature solder
The application of electronic components in thermal heating temperature is not high the components of multi component welding operation, step by step, and the general self extinction does not contain cadmium solder. In addition to bismuth solder, the welding process can also be based on user needs, the preparation of low temperature solder production of other varieties and resistant to low temperature solder.