In the welding of electronic circuit board, soldering tin often happens. For example, after soldering tin point pull the tip surface is rough, bridging, solder ball, dirty board, circuit board circuit. These problems is how to produce? The main materials of electronic solder solder wire, solder, flux, PCB board and electronic components parts. Which part of the problem will eventually affect the quality of solder. Today we introduce Victor Xinda several factors affecting the quality of solder!
Wet the surface 1:PCB. In PCB manufacturing process have plate drying program. When color solder appears generally are and temperature have a considerable relationship. Due to the special case of the PCB surface humidity high in tin and tin high-temperature liquid then indeed prone to explosion tin, when soldering of high temperature molten tin surface appear yellow. Then it is necessary to adjust the appropriate temperature of the furnace operation temperature.
2: when the circuit board welding took the aging process will find some PCB circuit, discharge circuit board is designed and the electronic device outside, can from the following aspects to find, circuit board soldering tin time is too short to eat, resulting in poor welding. The flux activity itself is not strong, weakened the solder wettability and its extension. The direction of the board of the line is in the direction of the tin wave and the direction of the tin wave.
3: after the solder was found to be dark tin, tin solder quality and welding results have a great relationship. Such as solder impurity too much solder melting residue will be suspended on the surface of the liquid tin and welding residue in situ stick on the PCB surface flux residues stay on the surface of the tin no cleaning and its acid corrosion of solder joints is also made into a tin of dull gray. There is also a side of the solder is too low. Soldering tin solder reached more than 50% of the solder will be shiny. Solder inside itself contains a variety of small amounts of metal elements, when the content of these elements in excess of its limit will affect the surface of the tin. When soldering tin requires no impurities on the surface of the tin liquid, when the surface of the tin liquid oxidation for a long time to clean up the surface will affect the surface gloss.