Restriction of Hazardous Substances Directive (Restrictionoftheuse of certain Hazardous Substances in electrical and electronic equipment Directiveon, referred to as RoHS)
RoHS and WEEE with the time release, can be regarded as an extension of the spirit of the WEEE, in addition to the standard product WEEE in the "medical equipment" and "monitoring equipment" has not been included, and the rest of the eight categories of electronic motor products are its limits. RoHS to limit of six harmful chemical substances lead (PB), mercury (Hg), cadmium (CD), hexavalent chromium (Cr6 +), polybrominated diphenyl (PBB) and polybrominated diphenyl ether (PBDE) with disable the content outline, which four chemical specification has appeared in the past "packaging waste management instruction" and "abandoned vehicles directive", this is the limit the scope of further expansion. EU countries also have to complete the legislative process before 2004/8/13, but the official entry into the effective date is slightly different, set in 2006/7/1.
The application scope and harm of RoHS restricted substances
Material application to the human body of hazardous substances
Lead (Pb) solder, cable, wire, plastic parts and components of anemia, abdominal pain, paralysis of polishing
Mercury (Hg) switches, liquid crystal displays, relays and light bulbs can cause poisoning, long-term retention of the body can damage the internal organs and nervous system
Cadmium (Cd) automatic vending machine power supply line, wire and switch contact toxicity, cause neurological disorders
Six valence chromium (Cr6+) shell surface treatment toxicity is strong, direct contact can cause skin inflammation, may cause genetic genetic defects, inhalation may cause cancer
Flame retardant of poly (PBB) plastics and printed circuit boards are suspected to have a chemical that disrupts the endocrine function (environmental hormones).
Poly (ether ether) (PBDE) plastics, rubber and printed circuit boards are suspected of having a chemical substance that disrupts the endocrine function (environmental hormones).
Note: trivalent chromium (Cr3+), tetravalent chromium (Cr4+) and chromium (Cr) does not have the toxicity
Analysis of these six kinds of chemical materials, for the manufacturing industry in Taiwan, the impact of the maximum should be the "lead" in the use of policy. China's electronic components industry structure is complete, including printed circuit boards, connectors, copper foil factory and passive component industries are the result of RoHS for the "lead" in electrical and electronic products in the limit with disabled affected: the traditional connector industry using tin lead in the plating process in electroplating solution (90 /10) and the welding tin lead (63/37) solder, weldability and corrosion resistance and welding tin lead alloy has the advantages of low cost, (reflow) (4) low temperature properties, but the industry due to the "lead-free process" (Note 5) trend, currently has developed a variety of connectors alternatives such as pure tin, nickel tin, copper and tin. A variety of electroplating solution, but because of lead-free process reflow temperature is much higher than that of lead process, in addition to welding equipment prior to purchase, the connector housing material also need to re adjust, basically "heat deformation temperature "The higher the plastic material, price is also higher; printed circuit board, passive components, copper foil substrates even the semiconductor industry are all faced with the same problem of" lead-free "high working temperature.
Because the harm has been caused by lead to environment and human body was confirmed, so nearly ten years "lead-free process" for electrical and electronic industry gradually all the attention, even all the components of electronic chemical materials manufacturers actively develop alternative materials and Cheng Fangshi, China in the global electronics industry supply system, is still in manufacturing for the spindle, so the downstream ICT industry in the industry more subject to international manufacturers purchase orders, and due to the specification of RoHS, SONY, HP, Acer and manufacturers begin to pay attention to the supply of "Shang industrial capacity of green management", Taiwan on behalf of the relevant industry has also received notice, will be completed at the end of 2005, with import material and processing of global environmental protection standards.
China's electronic components industry in addition to the increase in capital expenditure with production equipment manufacturers procurement procurement, purchase specific materials or the right to use the patent also have no small burden on the cost for small business owners, not to change the production mode of future orders will probably face "nothing"; but after a series of investment to meet the the buyer needs to re certification standards, "" wait for a long time, the liquidity risk of enterprises will be greatly improved, it regardless of whether or not to invest, small and medium-sized enterprises will face greater pressure on the operation, so the industry Xian that implementation of the EU RoHS directive on China's electronic components industry to "bigger" the trend will have the effect of accelerating.
Note 4: reflow reflow soldering, but our country engineering along since the Japanese technical terms, the proper name for solder paste welding, general circuit board manufacturing process, first in the board bearing pad printing paste, on the next point, first temporarily positioning, then and the electronic components of solder paste melting molten permanent weld. R e f l o w system refers to the solder paste has been melted into the solder ball shaped particles, again by heating and the re melt welding and become the process of solder joint.
Note 5: the international environmental protection regulations for lead-free and halogen-free restrictions are not products completely without lead or does not contain halogen compounds (P B or B P, B, D, and E), the current EU for lead-free and halogen-free threshold tailor 0.1 W T% (1 0 0 0 p p m) for the spec benchmark.