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Lead-free no clean flux spray flux

Update: 2016/3/6      View:
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Introduction
High flux is a no halogen, no loose flavor, lead-free, no other resins, non corrosive residue, low solid content, high activity of new environmental protection high efficiency and non cleaning flux.
This product is fully volatile, will not make contact with the ICT contact or contact the head of the problem, especially in lead free conditions, for most difficult to weld the surface has excellent welding. It can effectively reduce the surface tension of lead-free solder, enhance the wetting ability and reduce the welding and leakage.
Foam uniform, fine and rapid disaccommodation, welding process has no adverse phenomenon, the spot is full, strong light, evenly spread, quick drying, run welding excellent, excellent stability.
Track and clamp for non polluting soldering tin machine. Low smoke, no pungent odor, no pollution to the living environment, does not affect the health of the body, is designed for high wet gas environment and the design of products. Can easily through the TEST - PNC test, its physical and chemical indicators by the Ministry of information industry quality supervision and Inspection Center for special materials testing. All the properties reach or exceed Japan NS 832 flux level. Through the SGS certification, in line with the EU ROHS directive standard requirements, in the domestic leading level.
This product applies to electronic communications industry, computer automation production? Zhan better idle, Ba Lu Benedict II and charming dip education scholar fans a generous group striata Kou Mu II. Application in foam, spray, paint, coating, especially suitable for double-sided, multilayer board and paste in mixed circuit board and large scale spray wave soldering.

Appearance: no deposit, no turbidity, a clear, non stimulation odor, colorless and transparent or light yellow transparent liquid solid content (%): & le; 2.8 after welding, insulation resistance: 469 x 1012 density (g / cm 3, 23 DEG C):0.804 + 0.005 corrosion of copper test: do not penetrate the pH value: 5 ~ 6 dryness: non stick expansion rate (%):≥ 85% of the electrical migration: 96h/1.2 x 109 or 168h/1.0 109 ion pollution (ugNaCl/ cm 2): & lt; 0.25 main ingredients: low carbon alcohol solvent, surfactant, stabilizer, a film agent, foaming agent. Storage: This product is flammable, should be confined to far away from fire, heat source, spark point. Room temperature of the original packaging container sealed, shelf life of not less than 18 months.

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