historical background
In the early 1990s, in countries such as the United States, Europe and Japan, successively legislation of lead in industrial application of restrictions and lead-free solder research and technology development.
Leaded solder and lead alloy surface mount technology (SMT), for a long time, technology has been widely used in electronic products manufacturing, especially Sn Pb eutectic solder with the use of convenient, stable welding, the price of rationality, as a practical low-temperature alloy, at the same time, with unique properties (such as: low melting point, good ductility, fatigue resistance good, thermal cycling, good conductivity, combined with high), which is suitable to be applied in electronic products. The assembling process in the electronic industry are in high density, has served as the most appropriate and widely used role.
Lead solder in electronic connection has three functions: (a) complete the surface treatment of printed circuit boards (two) coated on the surface of the parts to provide the welding surface, (three) the electronic parts welding in the printed circuit board.
Although many PCB producer in the surface of the PWB production last action, replace leaded solder with organic materials (OSPs) alternative to new products, lead solder still lead treatment and continued the main loading and solder choice. Now, because of the universality and convenient electronic products, the household or consumer market all the extensive use of electronic products, as to take into account when the product end of life and waste (then), whether to landfill or incineration as the final processing, when the final component through the media environment and return to the environment will cause irreparable lead pollution, and on the earth's environment and human survival caused great harm.
Regulations and specifications
Many of the regulations currently being implemented or examined have a great impact on the "lead free electronic products". Therefore, these regulations and their relevant requirements of the "lead free" definition, we need to understand the need to understand. In the United States and solder flux tube, lower than the 0.2% lead content is regarded as free. The standard identified by the ISO in Europe is 0.1%; the European Union's auto life terminal and the hazardous substances prohibition directive identification standard is 0.1%; however, there is still no electronic assembly of lead-free definitions.
- American regulations
Legislative activities related to the United States: at present although there is no known states require lead-free, but really some states due to perceived to electronic products, materials for long-term environmental harm is starting to engaged in recycling of electronic products. Electronic recovery instruction (ERI) provides sustained observation on state and national level activities.
- Japan's regulations
At present domestic no pending regulations specifically requested banned lead element, anyway, Japan's trade ministry in May 1998 proposed recycling legislation; Japan EPA and the suggestions to reduce the use of elements lead to recovery and continued to increase in. 1998 renovation of the Japanese residential electronic recycling law, the requirements of the OEMs manufacturers in April 2001 1, a good collection and recycling of the four major products. Although this law does not mention the use of leaded products, however, there is still another law prohibiting the company to let the waste toxic logistics to the environment, these two bills for electronic products lead-free pressure.
- the EU regulations
WEEE/RoHS: as the EU continues to increase the pressure on the country, EC found that the drafting of the legislation to control toxic elements of electronic products is necessary. , considerable electronic industry in response to the first development of the "waste electrical, electronic equipment (WEEE) instruction and restriction of hazardous substances (RoHS) instruction" 2002/10, instruction in addition to prescribe the service life of the product at the end of the (then) after the recovery and reuse, and, also of lead, cadmium, mercury, chromium (VI); Cr + 6), brominated flame retardant (including in electronics with plastic components or put the coating material) specification limits the products of existence.
Put forward product specification packaging material (packaging, packaging, transport packaging) of lead, cadmium, mercury, chromium (hexavalent packing & packing Directive:1994 years; Cr ~ (+ 6)), the content of polyvinyl chloride (PVC), as in 2001 the metal limits the aggregate content shall not be more than 100 ppm (including cadmium shall not is higher than 5 ppm).
Vehicle End-of-life: in addition to the instructions in the end of the product life cycle after the recovery and reuse of responsibility, but also on the lead, cadmium, mercury, chromium, polyvinyl chloride content specification limits the existence of products.
PCB assembly (PCB Assembly Lead-Free) of the product tube operation
- purpose
Supplier switching products to lead free / hazardous substances prohibited in accordance with the requirements of the process and product reliability in lead-free solder on the same requirements, hazardous material compliance also contains material compliance.
In the process of
(1) such as JESD46-B and change all existing products to lead-free / hazardous substances prohibited compliance should be issued by the manufacturer to PCN file mode; any parts change on lead-free / hazardous substances prohibited compliance payable for major changes to the consideration.
(2) such as JESD48-A, all existing parts of the product should be notified to the end of the client.
(3) all manufacturers will be to provide bulletin, should provide technical route map products to customers, to denote a gauge change of painting and the fulfillment of the schedule for production of lead-free / hazardous substances prohibited product conformity; feasibility and product life cycle information recently dynamic and no lead / harm substances prohibited with products should be described in detail.