Solder development process
2016/3/6 view:
1991 and 1993: the United States Senate proposed "bill Reid", the requirements of electronic solder in the lead content of 0.1% or less, was strongly opposed by the United States Industry and died;
Since 1991, Nemi, NCMS, NIST, DIT, NPL, pcif, ITRI, jiep and other organizations have launched a special study of lead-free solder, the consumption of more than 20 million U.S. dollars, is still continuing;
1998: Japan revised home electronics recycling law, driven by the business sector to develop lead-free electronic products;
October 1998: the first batch production of lead-free electronic products come out, minidisc mj30 panasonic;
January 2000: Nemi recommended to the industrial standard lead-free solder, Sn-3.9Ag-0.6Cu for reflow soldering, Sn-0.7Cu or Sn-3.5Ag for wave soldering;
June 2000: the United States lead-free roadmap IPC fourth edition, recommended that the United States in 2001 to launch the company's lead-free electronic products, in 2004 to achieve a comprehensive lead-free;
August 2000: Japan's lead-free roadmap JEITA 1.3 edition published, it is recommended that Japan's corporate sector in 2003 to achieve standardization of lead-free electronic assembly;
January 2002: roadmap1.0 lead-free version of the European Union published, according to the results of the survey to provide the industry with an important statistical information on lead-free;
February 13, 2003, European Parliament and the European Conference of Ministers of the organization, formally approved the entry into force of the WEEE and RoHS directives, mandatory requirements since July 1, 2006 onwards, in the European market sales of electronic products must be for lead-free electronic products; (for individual types of electronic products temporarily excluded)
March 2003, the Ministry of information industry to develop the management of electronic information products pollution prevention and control measures, proposed since July 1, 2006, the state's focus on the market's electronic information products in the market can not contain Pb.
July 1, 2006, the EU "on in electrical and electronic products in the prohibition of the use of certain hazardous substances (RoHS) directive entered into force, mandatory requirements in the European market sales of electronic products must be for lead-free products, and expressly prohibited the use of six hazardous substances and limits. In order to adapt to the new EU RoHS standard, with the needs of the market and the development of lead-free solder products, referred to as "lead-free solder".
Since 1991, Nemi, NCMS, NIST, DIT, NPL, pcif, ITRI, jiep and other organizations have launched a special study of lead-free solder, the consumption of more than 20 million U.S. dollars, is still continuing;
1998: Japan revised home electronics recycling law, driven by the business sector to develop lead-free electronic products;
October 1998: the first batch production of lead-free electronic products come out, minidisc mj30 panasonic;
January 2000: Nemi recommended to the industrial standard lead-free solder, Sn-3.9Ag-0.6Cu for reflow soldering, Sn-0.7Cu or Sn-3.5Ag for wave soldering;
June 2000: the United States lead-free roadmap IPC fourth edition, recommended that the United States in 2001 to launch the company's lead-free electronic products, in 2004 to achieve a comprehensive lead-free;
August 2000: Japan's lead-free roadmap JEITA 1.3 edition published, it is recommended that Japan's corporate sector in 2003 to achieve standardization of lead-free electronic assembly;
January 2002: roadmap1.0 lead-free version of the European Union published, according to the results of the survey to provide the industry with an important statistical information on lead-free;
February 13, 2003, European Parliament and the European Conference of Ministers of the organization, formally approved the entry into force of the WEEE and RoHS directives, mandatory requirements since July 1, 2006 onwards, in the European market sales of electronic products must be for lead-free electronic products; (for individual types of electronic products temporarily excluded)
March 2003, the Ministry of information industry to develop the management of electronic information products pollution prevention and control measures, proposed since July 1, 2006, the state's focus on the market's electronic information products in the market can not contain Pb.
July 1, 2006, the EU "on in electrical and electronic products in the prohibition of the use of certain hazardous substances (RoHS) directive entered into force, mandatory requirements in the European market sales of electronic products must be for lead-free products, and expressly prohibited the use of six hazardous substances and limits. In order to adapt to the new EU RoHS standard, with the needs of the market and the development of lead-free solder products, referred to as "lead-free solder".
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