SMT basic terminology
A
Accuracy (precision): the difference between the measurement results and the target value.
Additive Process (process): a method of fabricating a PCB conductive wiring, by selective precipitation of conductive material on board layer (copper and tin).
Adhesion (adhesion): similar to the molecular attraction between.
Aerosol (gas solvent): small to a liquid or gas to air borne particles.
Angle of attack (angle of attack): the angle between the plane and the plane of the screen printing screen printing scraper.
Anisotropic adhesive (anisotropic adhesive): a conductive material, the particles only through the current in the direction of Z axis.
Annular ring (ring ring): conductive material around the borehole.
Application specific integrated circuit (ASIC application specific integrated circuit): customers customized for special purpose circuit.
Array (array): a set of elements, such as: solder ball, arranged in rows.
Artwork (wiring diagram) conductive wiring diagram of:PCB, used to produce the original photos, can any proportion of production, but is generally 3:1 or 4:1.
Automated test equipment (ATE): in order to evaluate the performance level, designed for automatic analysis function or static parameters of equipment, but also for fault isolation.
Automatic optical inspection (AOI automatic optical inspection): in the automatic system, use the camera to check the model or object.
B
Ball grid array BGA (ball grid array): integrated circuit packaging forms, the input and output points is solder balls in the bottom of the element surface according to the grid pattern arrangement.
Blind via (blind vias) conductive connection between the outer layer and the inner layer of the:PCB, not to the other side to the board.
Lift-off Bond (welding): the failure of the welding pin from the surface of the pad (the base of the circuit board) separately.
Agent Bonding (adhesive): the formation of multiple layers of adhesive agent.
Bridge (tin bridge): the two conductive connection of the conductor to connect the solder, causing a short circuit.
A conductive connection between two or more inner layers of via (a buried access hole):PCB (i.e., invisible to the outer layer).
C
System CAD/CAM (computer aided design and manufacturing system): computer aided design is the use of specialized software tools to design the structure of the printed circuit; computer aided manufacturing to convert this design into practical products. These systems include large scale memory for data processing and storage, input for design creation, and output devices for converting stored information into graphics and reports.
Action Capillary (capillary action): a natural phenomenon that melts the solder, which is counter gravity, flows in a solid surface near the surface.
Chip on board (chip on board (COB)): a hybrid technology, which uses the face on the stalemate in the chip components, traditionally the fly line specifically connected to the basal layer of the circuit board.
Tester Circuit (circuit tester): a method for testing PCB in batch production. Including: bar, pins, guide probe, internal trace footprints, loading plate, empty plate, and component testing.
Cladding (covering): a thin sheet of metal foil bonded to a plate layer to form a PCB conductive wiring.
Of the thermal expansion Coefficient (temperature coefficient of expansion): when the surface temperature of the material is increased, the rate of expansion of every temperature material (PPM) is measured.
Cleaning Cold (Leng Qingxi): an organic solution process, liquid contact to complete the removal of the residue after welding.
Cold solder joint (cold solder): a reflect humid enough of the welding point, its characteristic is, due to insufficient heating or improper cleaning, exterior gray, porous.
Density Component (component density):PCB on the number of elements divided by the area of the board.
Epoxy Conductive (conductive epoxy): a polymer material, by adding metal particles, usually silver, to make it through the current.
Conductive ink (conductive ink): glue used in thick film materials, forming a conductive wiring diagram PCB.
Conformal coating (conformal coating): a thin protective coating applied to the shape of the PCB compliant assembly.
Copper foil (copper): a negative quality of anode material and precipitation on the circuit substrate layer of a layer of thin, continuous metal foil and it as the PCB conductor. It is easily bonded to the insulating layer, the protective layer for printing, corrosion after forming a circuit pattern.
Copper mirror test (the mirror test): a flux corrosion test, using a vacuum film deposition on glass plate.
Cure (baking curing): changes in the physical properties of the material, through a chemical reaction, or pressure / no pressure on thermal reaction.
Cycle rate (circulation rate): a component patch nouns to measurement from fetching and to the plate to position and return the machine speed, also called test speed.
D
Data recorder (data recorder): at specific time intervals, from of measurement, acquisition of temperature on PCB thermocouple device.
Defect (defects): component or circuit unit deviate from the normal characteristics of acceptance.
Delamination (hierarchical): separation and separation between lamellar layer and conductive cover layer.
Desoldering (Xie Han): the welding element removing to repair or replacement method including: tin tin, vacuum suction with suction (Straw solder) and hot drawing.
Dewetting (goeswet): the process of molten solder to cover, after the recovery, leaving irregular residue.
DFM (Design for manufacturing.) production methods of products in the most effective way, time, cost and availability of resources into account.
Dispersant (dispersant): a chemical added to the water to increase its ability to particle.
Documentation (file system): on the assembly information, explain the design concept, basic components